Semiconductor Digest 2023 Media Planner - Flipbook - Page 4
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Dave Lammers, Contributing Editor
Dave Lammers started writing about the semiconductor industry while working at the
Associated Press Tokyo bureau in the early 1980s, a time of rapid growth for the industry.
He joined EE Times in 1985, covering Japan, Korea, and Taiwan for the next 14 years while
based in Tokyo. In 1998 Dave, his wife Mieko, and their four children moved to Austin to
set up a Texas bureau for E.E. Times. A graduate of the University of Notre Dame, Dave
received a master’s in journalism at the University of Missouri School of Journalism.
John Blyler, Contributing Editor
John has many years of technical and editorial experience in the semiconductor,
electronics, and system engineering spaces. Currently, he is the founder and CEO of JB
Systems, a high-tech media, education and engineering company. Previously, John was
the editor-in-chief of Chip Design and Semi-Manufacturing Design (SemiMD) magazines.
His works have appeared in numerous publications and with several companies including
the IEEE, Informa-Penton Electronic Design), Photonics Media, Wiley, Elsevier, Networking
World, Edutopia (George Lucas Foundation), Mentor, Cadence, Synopsys, Intel, Arm,
Mouser, Digikey, TI Jama Software, Dassault Systemes, Siemens and many others. John
teaches systems engineering and IOT Design as an affiliate professor at Portland State
University and an online lecturer at Univ. of California at Irvine. He holds a BS in
Engineering Physics from Oregon State Univ. and an MS in Electronic Engineering from
Cal. State Univ., Northridge.
Dick James, Contributing Editor
Dick James is an almost 50-year veteran of the semiconductor industry, working in the process
development, design, manufacturing, packaging and reverse engineering of semiconductor devices.
For over 20 years he worked with Chipworks (now TechInsights), an Ottawa, Canada-based specialty
reverse engineering company, and is now Fellow Emeritus with the company. He is also a Senior
Analyst for TechSearch International, based in Austin, a leading consulting company in the field of
advanced semiconductor packaging technology.